Signal integrity Analysis

We provide comprehensive system level SI/PI simulation services at package & PCB level and can resolve any kind of complex SI issue, PI issue for any problem related with s-parameters in the post-layout design.

• High speed serial/parallel interface analysis and design guidelines (DDR3, DDR4, multi-gigabit Serdes,  PCIe gen3 & gen4, XAUI, HDMI, SATA, USB, Flash, chip-to-chip IO, FPGA IO)
• Signal integrity & power integrity co-design SSN modelling
• pre-layout & post-layout SI analysis.
• IBIS/IBIS-AMI based system level SI evaluation.
• Routing studies, termination schemes, stackup design & analysis.
• Trace & Via design for controlled impedance using EM solver.
• Full-wave EM modelling of all kinds of interconnects (via, connector, end-to-end channel)
• Crosstalk and s-parameter modelling of traces and interconnects on package and board.
• Connector design modelling and simulation.
• IBIS model generation

Power integrity Analysis:

• Analyze and verify power supply quality at chip, package & board level.
• Target impedance estimation and optimization.
• Decoupling cap estimation and optimization
• Power-ground loop inductance & stackup optimization.
• S-parameter & parasitic extraction (R,L,C)
• IR drop analysis and give recommendation about placement of components.
• Time-domain power integrity noise estimation.

EMI/EMC Analysis:

• Board level & System level EMI/EMC Analysis.
• RE Analysis – Near field and Far field analysis
• RE and CE Analysis with Shield case
• Conduction noise (CE) analysis and modelling for Power lines
• Frequency V/S dB plot for Different standards
  (FCC, CISPR, VCCI or User specific)
• Electromagnetic susceptibility analysis
• 3D Magnetic/Electric & Current density Plot
• Filter design

ESD Analysis:

• Board level & System level ESD Analysis.
• ESD Circuit modelling and ESD GUN Model
• Air Charge ESD Simulation
• ESD Path analysis with 3D Simulation tools.

Thermal analysis:

• PCB and System level thermal analysis
• Joule heating effect analysis including power loss information on traces
• Heat sink and cooling proposals
• Metal core and thermal ladder PCB designs
• Major heat transfer mechanisms analysis viz., Conduction, Convection,
  Radiation

Detailed reports indicating component and board temperature profiles